Two photon imaging system

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Session 01 Stacked Image Sensors Session chair: Yusuke Oike (Sony)
Dun-Nien Yaung (TSMC) R01 Y. Kagawa1, N. Fujii2, K. Aoyagi2, Y. Kobayashi1, S. Nishi1, S. Takeshita1, J. Taura1, H. Takahashi2, Y. Nishimura2, K. Tatani2, M. Kawamura1, H. Nakayama1, T. Nagano2, K. Ohno2, H. Iwamoto2, S. Kadomura1, T. Hirayama2. 1Sony Semiconductor Manufacturing, Japan; 2Sony Semiconductor Solutions, Japan R02 Biay‐Cheng Hseih1, Sami Khawam1, Nousias Ioannis1, Mark Muir1, Khoi Le1, Keith Honea1, Sergio Goma1 , RJ Lin2, Chin‐Hao Chang2, Charles Liu2, Shang‐Fu Yeh2, Hong‐Yi Tu2, Kuo‐Yu Chou2, Calvin Chao2. 1Qualcomm Technologies Inc., USA; 2TSMC, Taiwan, ROC R03 V.C. Venezia, C. Shih, W.Z. Yang, Y. Zang, Z. Lin, L. A. Grant, and H. Rhodes. Omnivision Technologies, USA R04 Farah Fahim1, Grzegorz Deptuch1, Alpana Shenai1, Piotr Maj2, Piotr Kmon2, Paweł Grybos2, Robert Szczygieł2, D. Peter Siddons3, Abdul Rumaiz3, Anthony Kuczewski3, Joseph Mead3, Rebecca Bradford4, John Weizeorick4. 1Fermi National Accelerator Laboratory, USA; 2AGH-UST, Poland; 3Brookhaven National Laboratory, USA; 4Argonne National Laboratory, USA R05 Seiji Takahashi, Yi-Min Huang, Jhy-Jyi Sze, Tung-Ting Wu, Fu-Sheng Guo, Wei-Cheng Hsu, Tung-Hsiung Tseng, Chia-Ching Liao, Chin-Chia Kuo, Tzu-Hsiang Chen, Wei-Chieh Chiang, Chun-Hao Chuang, Keng-Yu Chou, Chi-Hsien Chung, Kuo-Yu Chou, Chien-Hsien Tseng, Chuan-Joung Wang and Dun-Nien Yaung. Taiwan Semiconductor Manufacturing Company, Taiwan, ROC R06 R. Fontaine. TechInsights, Canada Session 02 Noise Session chair: Boyd Fowler (OmniVision Technologies)
Hidekazu Takahashi (Canon)

Presentation slides

R07 Dan McGrath1, Steve Tobin1, Vincent Goiffon2, Marius Sergent2, Pierre Magnan2, Alexandre Le Roch3. 1BAE Systems, USA; 2ISAE-SUPAERO, Université de Toulouse, France; 3CNES, France R08 Masafumi Tsutsui1, Tatsuya Hirata1, Keishi Tachikawa1, Ikuo Mizuno1, Masakatsu Suzuki1, Dmitry Veinger2, Adi Birman2 & Assaf Lahav2. 1Towerjazz Panasonic Semiconductor Co. Ltd., Japan; 2TowerJazz, Israel R09 Man-Lyun Ha,  Min-Kyu Kang, Sang-Won Yoon, Chang-Hoon Han, Juil Lee, and Yoon-Jong Lee. Dongbu HiTek, Korea R10 Calvin Chao, Honyih Tu, Thomas Wu, Kuo-Yu Chou, Shang-Fu Yeh, and Fu-Lung Hsueh. Taiwan Semiconductor Manufacturing Company, Taiwan, ROC R11 Shinya Ichino1, Takezo Mawaki1, Shunichi Wakashima1, Akinobu Teramoto2, Rihito Kuroda1, Phillipe Gaubert2, Tetsuya Goto2, Tomoyuki Suwa2 and Shigetoshi Sugawa1,2. 1Graduate School of Engineering, Tohoku University, Japan; 2New Industry Creation Hatchery Center, Tohoku University, Japan R12 Rihito Kuroda1,Akinobu Teramoto2 and Shigetoshi Sugawa1,2. 1Graduate School of Engineering, Tohoku University, Japan; 2New Industry Creation Hatchery Center, Tohoku University, Japan Session 03 Image Sensor Optics Session chair: Bumsuk Kim (Samsung) R13 Yasuyuki Fujihara1, Yusuke Aoyagi1, Satoshi Nasuno1, Shunichi Wakashima1, Rihito Kuroda1, Kohei Terashima1, Takahiro Ishinabe1, Hideo Fujikake1, Kazuhiro Wako2 and Shigetoshi Sugawa1. 1Tohoku University, Japan; 2National Institute of Technology, Sendai College, Japan R14 Li-Kai Lee1, Chih-Chieh Chang1, Yu-Kun Hsiao1, JC_Hsieh1, Kazuaki Hashimoto2, Chien-Hsien Tseng2, Chun-Hao Chuang2,
Wei-Chieh Chiang2. 1VisEra Technologies Company, Taiwan; 2Taiwan Semiconductor Manufacturing Company, Taiwan R15 Yuichiro Yamashita1, Masayuki Uchiyama1, Dun-Nian Yaung1, Natsumi Minamitani2 and Yoshinari Kamakura2. 1Taiwan Semiconductor Manufacturing Company, Ltd., Taiwan; 2Osaka University, Japan R16 Atsushi Ono1, Atsutaka Miyamichi2, Hiroki Kamehama2, Keiichiro Kagawa1, Keita Yasutomi1, and Shoji Kawahito1. 1Research Institute of Electronics, Shizuoka University, Japan; 2 Graduate School of Integrated Science and Technology, Shizuoka University, Japan R17 Sheng-Chuan Cheng,Chih-Ching Chang, Kuo-Feng Lin, Chien-Hsiung Huang, Lin-Ya Tseng, Hui-Min Yang, Ken Wu, JC Hsieh. VisEra Technologies Company, Taiwan Session 04 Poster Presentations Session chair: Vladimir Koifman (Analog Value)
Jun Ohta (Nara Institute of Science and Technology) P01 Shunsuke Okura1,Yuki Nakura2, Masayoshi Shirahata3, Mitsuru Shiozaki3, Takaya Kubota3, Kenichiro Ishikawa1, Isao Takayanagi1, and Takashi Fujino4. 1Brillnics Japan Inc., Japan; 2Graduate School of Science and Technology Ritsumeikan University, Japan; 3Department of Science and Engineering Ritsumeikan University, Japan; 4Research Organization of Science and Engineering Ritsumeikan University, Japan P02 Kiyotaka Sasagawa, Makito Haruta, Takahiro Yamaguchi, Yasumi Ohta, Toshihiko Noda, Takashi Tokuda, and Jun Ohta. Nara Institute of Science and Technology, Japan P03 Shota Hiramatsu1, Kosuke Wakita1, Seokjin Na2, Sayuri Yokoyama2, Masayuki Ikebe2 and Eiichi Sano1. 1Research Center for Integrated Quantum Electronics, Hokkaido University, Japan; 2Graduate School of Information Science and Technology, Hokkaido University, Japan P04 Philippe Martin-Gonthierr, Pierre Magnan, Olivier Marcelot. ISAE-SUPAERO, Université de Toulouse, France P05 Jeroen Rotte1, Peter Centen1, Juul van den Heijkant1, Adi Birman2, Dmitry Veinger2. 1Grass Valley, The Netherlands; 2TowerJazz, Israel P06 Scott Lindner1,2, Chao Zhang3, Ivan Michel Antolovic3, Juan Mata Pavia1,2, Martin Wolf1, Edoardo Charbon2,3. 1University Hospital Zurich, Switzerland; 2EPFL, Switzerland; 3TUDelft, The Netherlands P07 Neale A.W. Dutton1, Tarek Al Abbas2, Istvan Gyongy2, Robert K. Henderson2. 1STMicroelectronics, UK; 2The University of Edinburgh, UK P09 Eric G. Stevens, J. Clayhold, H. Doan, R. Fabinski, J. Hynecek, S. Kosman, and C. Parks. ON Semiconductor, USA P10 T. Al Abbas1, N.A.W. Dutton2, O. Almer1, F.M. Della Rocca1,2, S. Pellegrini2, B. Rae2, D. Golanski3 and R.K. Henderson1. 1The University of Edinburgh, UK; 2STMicroelectronics, UK; 3STMicroelectronics, France P11 Lucio Pancheri1, Andrea Ficorella1, Paolo Brogi2,3, Gianmaria Collazuol4, Gian-Franco Dalla Betta1, Pier Simone Marrocchesi2,3, Fabio Morsani3, Lodovico Ratti5, Aurore Savoy-Navarro6. 1DII, Università di Trento and TIFPA-INFN, Italy; 2DFSTA, Università di Siena, Italy; 3NFN Sezione di Pisa, Italy; 4DFA, Università di Padova, and INFN Sezione di Padova, Italy; 5DIII, Università di Pavia, and INFN Sezione di Pavia, Italy; 6Laboratoire APC, University Paris-Diderot/CNRS, France P12

Revised version on 2017-06-09

Manuel Innocent, Thomas Cools, Carl Luypaert, Cedric Esquenet, Wiet Vroom, Ishwar Chandra Mudegowdar, Ioannis Thanasopoulos, Patrick Pintens, Joost Decupere, Tomas Geurts. ON Semiconductor, Belgium P13

Poster presentation

Konstantin D. Stefanov, Andrew S. Clarke, James Ivory and Andrew D. Holland. The Open University, UK P14 Rafal Kleczek, Pawel Grybos, Robert Szczygiel. AGH University of Science and Technology, Poland P15 Jan Bosiers, Erik-Jan Manoury, Harry van Kuijk, Wilco Klaassens, Holger Stoldt, René Leenen, Herman Peek, Walter de Laat. Teledyne DALSA Professional Imaging, The Netherlands P16 Hyun Jung Lee, Paul Donegan, David Atos, Feng-Hua Feng, Eric Fox, Roula Ghannoum, Jason Guan, Willy Maes, David Marchesan, Matt Moser, Nixon O, Mark Ruiter, Tsung-Hsun Tsai, and Laurens Korthout. Teledyne DALSA Inc., Canada P17 Cheng Ma1, Quan Zhou1, Lanlan Liu1, Yang Li1, Adri Mierop2, Agnes Kleimann2, Xinyang Wang1. 1Gpixel Inc., China; 2now with X-FAB Semiconductor Foundries AG, Germany P18 David San Segundo Bello1, Maarten De Bock1, Pierre Boulenc1, Roeland Vandebriel1, Linkun Wu1,2, Jan Van Olmen1, Vezio Malandrucculo1, Jan Craninckx1, Luc Haspeslagh1, Stefano Guerrieri1, Maarten Rosmeulen1, Jonathan Borremans1. 1imec, Belgium; 2Vrije Universiteit Brussel, Belgium P19

Poster presentation

Salvatore Gnecchi, Carl Jackson. SensL Technologies, Ireland P20 Ward van der Tempel, Alper Ercan, Thomas Finateu, Korina Fotopoulou, Christian Mourad, Florentina Agavriloaie, Sebastien Resimont, Luca Cutrignelli, Peter Thury, Camilo Ernesto Medina, Sa Xiao, Jean-Luc Loheac, Jernej Perhavc, Tomas Van de Hauwe, Victor Belokonskiy, Luc Bossuyt, Wouter Aerts, Marc Pauwels, Daniel Van Nieuwenhove. Softkinetic, Belgium P21 Keiichiro Kagawa1,2, Nobukazu Teranishi1,3, Keita Yasutomi1, Rolf Saager2, Min-Woong Seo1, Shoji Kawahito1, Anthony Durkin2, and Bruce Tromberg2. 1Shizuoka University, Japan; 2UC Irvine, USA;  3University of Hyogo, Japan P22 Fabio Acerbi1, Manuel Moreno Garcia1, Gözen Köklü2, Bernhard Büttgen2, Radoslaw Gancarz2, Alice Biber2, Daniel Furrer2, David Stoppa1. 1Fondazione Bruno Kessler, Italy; 2Heptagon Advanced Micro Optics Pte Ltd., Switzerland P24 Masahide Goto1, Yuki Honda1, Toshihisa Watabe1, Kei Hagiwara1, Masakazu Nanba1, Yoshinori Iguchi1, Takuya Saraya2, Masaharu Kobayashi2, Eiji Higurashi2, Hiroshi Toshiyoshi2, and Toshiro Hiramoto2. 1NHK Science and Technology Research Laboratories, Japan; 2The University of Tokyo, Japan P25 Daniel Van Blerkom, Steve Huang, Barmak Mansoorian. Forza Silicon Corporation, USA P26 Maarten De Bock, Mingxu Liu, Peter Van Wesemael, Annachiara Spagnolo, Jan Craninckx, Koen De Munck, Celso Cavaco, Luc Haspeslagh, Stefano Guerrieri, Maarten Rosmeulen, Jonathan Borremans. imec, Belgium P27 Salman Kabir, Michael Guidash, Thomas Vogelsang, Craig Smith, Alex Schneider, Jay Endsley. Rambus Inc., USA P28 Yang Ni. New Imaging Technologies, France P29 K. Mori, S.Okura, T. Hasegawa, S. Tanaka and I.Takayanagi. Brillnics Japan Inc., Japan P30

Poster presentation

Bart Dierickx1, Jean Bourgain2, Bert Luyssaert1. 1Caeleste, Belgium; 2Institute for Advanced Study, USA P31 Kangbong Seo, Sungryong Lee, Peter Ahn, Dohwan Kim and Kwangbo Cho. SK Hynix semiconductor Inc., Korea P32 W. Gao, M. Guidash, N. Li, R. Ispasoiu, P. R. Ailuri, N. Palaniappan, D. Tekleab, M. Rahman. ON Semiconductor, CA, USA P33 Preethi Padmanabhan1, Bruce Hancock2, Shouleh Nikzad2, L. Douglas Bell2, Kees Kroep3, Edoardo Charbon1,3. 1AQUA Laboratory, EPFL, Switzerland; 2Jet Propulsion Laboratory, California Institute of Technology, USA; 3AQUA Laboratory, TU Delft, The Netherlands P34 T. Okino, S. Yamahira, S. Yamada, Y. Hirose, A. Odagawa, Y. Kato and T. Tanaka. Panasonic Corporation,  Japan P35 Yan-Rung Lin1, Pei-Wen Yen1, Sheng-Min Yu2, Shiu-Cheng Lou1, Kai-Ping Chuang1, Bor-Nian Chuang1, Yen-Chih Chiou3, Chih-Cheng Hsieh3, Cheng-Hung Hou4, Feng-Yu Tsai4. Industrial Technology Research Institute, 1Center for Measurement Standards, 2Material and Chemical Research Laboratories, Taiwan; 3National Tsing Hua University, Taiwan; 4National Taiwan University, Taiwan P38 S. Benhammadi1, B. Marsh1, K. Taylor2, W. Chan2, A. Birman3, A. Lahav3, A. Fenigstein3, R. Turchetta4. 1STFC Rutherford Appleton Laboratory, UK; 2Specialised Imaging, UK; 3TowerJazz Semiconductor Ltd., Israel; 4WegaPixel SL, Spain P39 C.G. Jakobson, I. Pivnik, R. Dobromislin, G. Zohar, O. Cohen, Y. Chaham, N. Shiloah, R. Talmor, E. Ilan, I. Nevo, W. Freiman, N. Ben Ari, R. Fruhi, T. Shapira, R. Fraenkel. SCD Semiconductor Devices, Israel P40 Chanmin Park1, Injun Park1, Woo Jin Jo1, Jimin Cheon2 and Youngcheol Chae1. 1Yonsei University, Korea; 2Kumoh National Institute of Technology, Korea P41 T. Watanabe1, T. Takeuchi2, O. Ozawa3, H. Komanome3, T. Akahori1, K. Tsuchiya2. 1Brookman Technology, Inc., Japan; 2Japan Atomic Energy Agency, Japan; 3Ikegami Tsushinki Co., Ltd., Japan P42 Y. Takemoto, M. Tsukimura, N. Takazawa, H. Kato, S. Suzuki, J. Aoki, T. Kondo, H. Saito, Y. Gomi, S. Matsuda, and Y. Tadaki. Olympus Corporation, Japan P43 Young-Jun Kwon1, Sung-Kun Park1, Sung-Wook Cho1, Kyoung-In Lee1, Sung-Man Kim1, Chris Hong1, In-Wook Cho1, Jae-Hyun Park2, and Kyung-Dong Yoo2. 1SK Hynix, Korea; 2Hanyang University, Korea P44 Three-Transistor-Pixel CMOS Image Sensor for 8K Super Hi-Vision Stacked Sensor with Highly Sensitive Photoconversion Layer Toshihisa Watabe, Yuki Honda, Masakazu Nanba, Hiroshi Ohtake, and Misao Kubota. NHK Science and Technology Research Laboratories, Japan P45 Flavien Hirigoyen. STMicroelectronics, France Session 05 Photon Counting and Photon-based Imaging Session chair: Bart Dierickx (Caeleste)
Neale A.W. Dutton (STMicroelectronics)

Presentation slides

R18 Jiaju Ma1, Saleh Masoodian1, Tzu-Jui Wang2 and Eric R. Fossum1. 1Thayer School of Engineering at Dartmouth College, USA; 2Taiwan Semiconductor Manufacturing Company, Taiwan

Presentation slides

R19 Saleh Masoodian1, Jiaju Ma1, Dakota Starkey1, Yuichiro Yamashita2, and Eric R. Fossum1. 1Thayer School of Engineering, Dartmouth College, USA; 2Taiwan Semiconductor Manufacturing Company (TSMC), Taiwan

Presentation slides

R20 Arin Can Ulku1, Claudio Bruschini1, Xavier Michalet2, Shimon Weiss2, Edoardo Charbon1. 1AQUA laboratory, EPFL, Switzerland; 2University of California at Los Angeles, USA R21 Ziyang You1, Luca Parmesan1, Sara Pellegrini2, Robert K. Henderson1. 1The University of Edinburgh, UK; 2STMicroelectronics, UK; now with Fondazione Bruno Kessler, Italy R22 Istvan Gyongy1, Tarek Al Abbas1, Neale A.W. Dutton2, Robert K. Henderson1. 1The University of Edinburgh, U.K.; 2STMicroelectronics, U.K. R23 Pengfei Sun1,2, Junjie Weng1, Ryoichi Ishihara1 and Edoardo Charbon1. 1Delft University of Technology, The Netherlands; 2X-FAB Semiconductor Foundries AG, Germany Session 06 Invited Presentation and Range Imaging Session chair: David Stoppa (Fondazione Bruno Kessler)
Gennadiy Agranov (Apple) Invited Presentation-I I1 Chiao Liu, Michael Hall, Renzo De Nardi, Nicholas Trail, Richard Newcombe. Oculus Research, Facebook Inc., USA

Revised version per 2017-06-05

R24 Keita Yasutomi,  Yuki Morikawa, Shoma Imanishi, Taishi Takasawa, Keiichiro Kagawa, Shoji Kawahito. Shizuoka University, Japan R25 Augusto Ronchini Ximenes1, Preethi Padmanabhan2, and Edoardo Charbon1,2. 1Delft University of Technology, The Netherlands; 2AQUA Laboratory, EPFL, Switzerland R26 Matteo Perenzoni1, Daniele Perenzoni1, David Stoppa1, Alexandre Pollini2, Jacques Haesler2, Christophe Pache2. 1Fondazione Bruno Kessler, Italy; 2CSEM, Switzerland R27 Boris Rodrigues1,3, Marie Guillon2, Nicolas Billon-Pierron2, Jean-Baptiste Mancini2, Olivier Saxod2, Benoit Giffard2, Yvon Cazaux2,
Pierre Malinge3, Patrice Waltz3, Auguste Ngoua3, Yannick Kerleguer3, Alisée Taluy3, Sarah Kuster3, Sylvain Joblot3, François Roy3, Guo-Neng Lu1. 1Univ. Claude Bernard Lyon 1, France; 2Univ. Grenoble Alpes, France; 3STMicroelectronics, France R28 Yibing M. Wang1,3, Ilia Ovsiannikov1,3, Jang-Woo You3, Peter Deane2, Dirk Smits2, Yong-Hwa Park3, Maarten Niesten2, Sungwoo Hwang 3, Chilhee Chung3. 1Samsung Semiconductor, Inc., USA; 2Samsung Strategy and Innovation Center, USA; 3Samsung Advanced Institute of Technology, Korea; Now with KAIST Session 07 High Dynamic Range Session chair: Johannes Solhusvik (OmniVision Technologies)
Orly Yadid-Pecht (University of Calgary) R29 I. Takayanagi, N. Yoshimura, K. Mori, S. Tanaka, S. Matsuo, H. Abe, N. Yasuda, K. Ishikawa, S. Okura, S. Ohsawa and T. Otaka. Brillnics Japan Inc., Japan R30 Frédéric Lalanne, Pierre Malinge, Didier Hérault and Clémence Jamin-Mornet. STMicroelectronics, France R31 Tomas Geurts, Bart Cremers, Manuel Innocent, Wiet Vroom, Cedric Esquenet, Thomas Cools, John Compiet, Burak Okcan, Genis Chapinal, Carl Luypaert, Patrick Pintens, Roel Aerts. ON Semiconductor, Belgium R32 Gaozhan Cai1, Wei Wang1, Bert Luyssaert1, Bart Dierickx1, Gerlinde Ruttens1, Bert Uwaerts1, Dirk Uwaerts1, Jente Basteleus1, Jens De Vroe1, Walter Verbruggen1, Peng Gao1, Donal Denvir2 , Philip Steen2. 1Caeleste CVBA, Belgium; 2Andor Technology Ltd., UK R33 Xiaoliang Ge1, Albert Theuwissen1,2. 1Delft University of Technology, the Netherlands; 2Harvest Imaging, Belgium R34 Sergey Velichko1, Scott Johnson1, Dan Pates1, Chris Silsby2, Cornelis Hoekstra2, Ray Mentzer2, Jeff Beck2. 1ON Semiconductor, ID, USA; 2ON Semiconductor, OR, USA

Presentation slides

R35 Johannes Solhusvik1, Sam Hu2, Robert Johansson1, Zhiqiang Lin2, Siguang Ma2, Keiji Mabuchi2, Sohei Manabe2, Duli Mao2, Bill Phan2, Howard Rhodes2, Charles Shan2, Eric Webster2, and Trygve Willassen1. 1OmniVision Technologies, Norway; 2OmniVision Technologies, USA Session 08 Invited Presentation and High Speed Session chair: Shigetoshi Sugawa (Tohoku University)
Michael Guidash (RM Guidash Consulting) Invited Presentation-II I2 Cheng Lei1, Yasuyuki Ozeki2, and Keisuke Goda1,3,4. 1Department of Chemistry, University of Tokyo, Japan; 2Department of Electrical Engineering and Information Systems, University of Tokyo, Japan; 3University of California, Los Angeles, USA; 4Japan Science and Technology Agency, Japan R36 Takeharu Goji Etoh1,2, Anh Quang Nguyen1, Yoshinari Kamakura2, Kazuhiro Shimonomura1, Yen Le Thi2 and Nobuya Mori2. 1Ritsumeikan University, Japan; 2Osaka University, Japan R37 Manabu Suzuki1, Masashi Suzuki1, Rihito Kuroda1, Yuki Kumagai2, Akira Chiba2, Noriyuki Miura2, Naoya Kuriyama2 and Shigetoshi Sugawa1. 1Tohoku University, Japan; 2LAPIS Semiconductor Miyagi Co., Ltd., Japan R38 L. Wu1,2, D. San Segundo Bello2, P. Coppejans2, A. Süss2, M. Rosmeulen2,
J. Craninckx2, P. Wambacq1,2, J. Borremans2. 1Vrije Universiteit Brussel, Belgium; 2imec, Belgium R39 Toshinori Otaka, Shintaro Maekawa, Hiroyuki Yamaguchi and Takayuki Hamamoto. Tokyo University of Science, Japan R40 P. Maj1, E. Dufresne2, P. Grybos1, K. Kasinski1, P. Kmon1, A. Koziol1, S. Narayanan2, A. Sandy2, R. Szczygiel1, Q. Zhang2. 1AGH University of Science and Technology, Poland; 2Argonne National Laboratory, USA Session 09 ADC Session chair: Guy Meynants (AMS)

Presentation slides

R41 Akira Matsuzawa, and Masaya Miyahara. Tokyo Institute of Technology, Japan R42 Deyan Levski1, Martin Wäny2, Bhaskay Choubey1. 1University of Oxford, UK; 2Austria Microsystems AG., Portugal R43 Tsung-Hsun Tsai, Paul Donegan, David Atos, Feng-Hua Feng, Eric Fox, Roula Ghannoum, Jason Guan, Tihomir Hodalin, Hyun Jung Lee, Willy Maes, David Marchesan, Brad Moon, Matt Moser, Mark Ruiter, and Laurens Korthout. Teledyne DALSA Inc., Canada

Revised version on 2017-06-12

R44 Fei Wang1, Liqiang Han2, Albert J. P. Theuwissen1,3. 1Delft University of Technology, The Netherlands; 2Tianjin University, China; 3Harvest Imaging, Belgium R45 J. A. Segovia1, F. Medeiro1,2, A. González1, A. Villegas1, A. Rodríguez-Vázquez1,2. 1Teledyne AnaFocus, Spain; 2Inst. of Microelectronics of Seville (Univ. de Sevilla & CSIC), Spain R46 Yoshio Hagihara, Yusaku Koyama, Susumu Yamazaki, Takanori Tanaka, Atsuko Kume, Yosuke Kusano, Mai Arita, Masashi Saito, and Yoshihisa Okada. Olympus Corporation, Japan Session 10 Invited Presentation and Specialty Image Sensors Session chair: Edoardo Charbon (Delft Univ. of Technology)
Pierre Magnan (ISAE) Invited Presentation-III I3
—World’s First 8K Rigid Endoscope Camera— Kenkichi Tanioka, Medical Imaging Consortium, Japan R47 Shouleh Nikzad1, April D. Jewel1, Alex G. Carver1, John J. Hennessy1, Michael E. Hoenk1, Sam Cheng1, Timothy M. Goodsall1, Gillian Kyne2, Erika Hamden2, and Todd J. Jones1. 1Jet Propulsion Laboratory, California Institute of Technology, USA; 2California Institute of Technology, USA R48 Navid Sarhangnejad, Hyunjoong Lee, Nikola Katic, Matthew O’Toole, Kiriakos Kutulakos, Roman Genov. University of Toronto, Canada R49 Atsushi Nose1, Tomohiro Yamazaki1, Hironobu Katayama1, Shuji Uehara1, Masatsugu Kobayashi1, Sayaka Shida1, Masaki Odahara2, Kenichi Takamiya2, Yasuaki Hisamatsu2, Shizunori Matsumoto2, Leo Miyashita3, Yoshihiro Watanabe3, Takashi Izawa1, Yoshinori Muramatsu1, Yoshikazu Nitta1, Masatoshi Ishikawa3. 1Sony Semiconductor Solutions, Japan; 2Sony LSI Design, Japan; 3The University of Tokyo, Japan

Presentation slides

R50 Pierre Boulenc1, Jo Robbelein1, Linkun Wu1,2, Vasyl Motsnyi1, Luc Haspeslagh1, Stefano Guerrieri1, Jonathan Borremans1, Maarten Rosmeulen1. 1imec, Belgium; 2Vrije Universiteit Brussel, Belgium Session 11 Invited Presentation and Non-Visible Imaging Session chair: Shouleh Nikzad (Jet Propulsion Laboratory)
Vyshnavi Suntharalingam (MIT) Invited Presentation-IV I4 Satoshi Miyazaki. The National Astronomical Observatory of Japan, Japan R51 Sumeet Shrestha1, Hiroki Kamehama1, Keita Yasutomi1, Keiichiro Kagawa1, Nobukazu Teranishi1, Ayaki Takeda2, Takeshi Go Tsuru2, Yasuo Arai3 and Shoji Kawahito1. 1Shizuoka University, Japan; 2Kyoto University, Japan; 3High Energy Accelerator Research Organization (KEK), Japan R52 Michael E. Hoenk1, April D. Jewell1, Shouleh Nikzad1, Doug Trotter2, Quinn Looker2, Gideon Robertson2. 1Jet Propulsion Laboratory, California Institute of Technology, USA; 2Sandia National Laboratories, USA R53 Lionel Barrow, Nikolai Bock, Aurelien Bouvier, Dario Clocchiatti, Jian Feng, Naveen Kolli, Andras Pattantyus, Vitanshu Sharma, Tzi-Hsiung Shu, Emanuele Mandelli. InVisage Technologies, USA

Presentation slides

R54 Pawel E. Malinowski1, Epimitheas Georgitzikis1,2, Jorick Maes3,4,Mehedi Mamun1,4, Oscar Enzing1, Fortunato Frazzica1,5, Jan Van Olmen1, Piet De Moor1, Paul Heremans1,2, Zeger Hens3,4, and David Cheyns1. 1IMEC, Belgium; 2KU Leuven, Belgium; 3Physics and Chemistry of Nanostructures, Ghent University, Belgium; 4Center for Nano- and Biophotonics, Ghent University, Belgium; 5Vrije Universiteit Brussel, Belgium R55 Vincent Goiffon1, Serena Rizzolo1, Franck Corbière1, Sébastien Rolando1, Aziouz Chabane1, Marius Sergent1, Philippe Paillet2, Sylvain Girard3, Magali Estribeau1, Pierre Magnan1, Marco Van Uffelen4, Laura Mont Casellas4, Marc Gaillardin2, Robin Scott5 and Wouter De Cock6. 1ISAE-SUPAERO, France; 2CEA DAM-DIF, France; 3Université de Saint-Etienne, France; 4Fusion for Energy, Spain; 5Oxford Technologies Ltd., UK; 6SCK-CEN, Belgium Session 12 Global Shutter Session chair: Eric Stevens (ON Semiconductor)
Daniel Van Blerkom (Forza Silicon) R56 Assaf Lahav1, Dmitry Veinger1 Adi Birman1, Masakatsu Suzuki2, Tatsuya Hirata2, Keishi Tachikawa2, Masafumi Tsutsui2, Toshifumi Yokoyama2, Yoshiaki Nishi2 and Ikuo Mizuno2. 1TowerJazz Semiconductors, Israel; 2Towerjazz Panasonic semiconductor, Japan

Revised version on 2017-06-05

R57 Hiroshi Sekine, Masahiro Kobayashi, Yusuke Onuki, Kazunari Kawabata, Toshiki Tsuboi, Yasushi Matsuno, Hidekazu Takahashi, Shunsuke Inoue, and Takeshi Ichikawa. Canon Inc., Japan R58 Toshifumi Yokoyama1, Masakatsu Suzuki1, Yoshiaki Nishi1, Ikuo Mizuno1 and Assaf Lahav2. 1Towerjazz Panasonic semiconductor Co,. Ltd., Japan; 2TowerJazz SemiConductors, Israel R59 Andreas Süss1, Linkun Wu2,1, Jean-Luc Bacq1, Annachiara Spagnolo1, Philippe Coppejans1, Vasyl Motsnyi1, Luc Haspeslagh1, Jonathan Borremans1, Maarten Rosmeulen1. 1IMEC, Belgium; 2Vrije Universiteit Brussel, Belgium R60 David Price1, Rick Jerome1, Akihiro Hasegawa1, Jeff Gambino1, Rusty Winzenread2, Kyle Thomas2, Andrew Piner2, Michael Wu3, Patti Guidash4, Tom Carducci4, Tom Frank4, Bill Desjardin4, Rich Brolly4, Thad Smith5, Brandon Riebeek5, Eddie Glines5, Gerald Heim6, Tom Ebben6, Rino Marinelli7, Onorato Di Cola7, Giovanni De Amicis7. 1ON Semiconductor, OR, USA; 2ON Semiconductor, CA, USA; 3ON Semiconductor, AZ, USA; 4ON Semiconductor, NY, USA; 5ON Semiconductor, ID, USA; 6Ball Aerospace, USA; 7LFoundry, Italy R61 Guy Meynants, Bram Wolfs, Jan Bogaerts, Peishuo Li, Zhisheng Li, Yongjia Li, Ybe Creten, Koen Ruythooren, Pascale Francis, Raf Lafaille, Pieter De Wit, Gerd Beeckman, Jan Martin Kopfer. AMS, Belgium Closing Remarks



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